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DIPLOMA in Electronics Communication Engineering at Shri Krishan Institute of Engineering and Technology
Kurukshetra, Haryana
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About the Specialization
What is Electronics & Communication Engineering at Shri Krishan Institute of Engineering and Technology Kurukshetra?
This Electronics & Communication Engineering Diploma program at Shri Krishan Institute of Engineering and Technology focuses on equipping students with fundamental and advanced knowledge crucial for the rapidly evolving electronics sector. The curriculum is designed to meet the demands of Indian industries, emphasizing practical skills alongside theoretical understanding. It covers key areas like analog and digital electronics, communication systems, microcontrollers, and embedded systems, preparing graduates for a dynamic career landscape.
Who Should Apply?
This program is ideal for recent 10th-pass graduates eager to build a foundational career in electronics. It also caters to individuals seeking a direct entry into the technical workforce in core engineering roles or those aspiring to pursue higher technical education. Students with a strong aptitude for science, mathematics, and problem-solving, particularly those interested in hardware design, testing, and maintenance, will find this program highly rewarding.
Why Choose This Course?
Graduates of this program can expect diverse India-specific career paths in manufacturing, telecommunications, consumer electronics, and defense sectors. Entry-level salaries typically range from INR 1.8 Lacs to 3 Lacs per annum, with significant growth potential for experienced professionals (up to 6-8 Lacs or more). The program aligns with industry requirements, preparing students for roles in testing, assembly, maintenance, and junior engineering positions, often serving as a stepping stone for B.Tech lateral entry.
Student Success Practices
Foundation Stage
Strengthen Core Science and Math- (Semester 1-2)
Dedicate consistent effort to understanding fundamental concepts in Physics, Chemistry, and Mathematics from semesters 1 and 2. Utilize online platforms for problem-solving and conceptual clarity, as these form the bedrock for advanced engineering subjects.
Tools & Resources
Khan Academy, NCERT textbooks, HSBTE recommended books, Peer study groups
Career Connection
A strong foundation ensures better comprehension of complex ECE concepts in later semesters, crucial for technical interviews and problem-solving in any electronics role, from design to maintenance.
Master Basic Lab Skills- (Semester 1-2)
Actively participate in all practical sessions, especially in Applied Physics, Chemistry, and Computer Fundamentals labs. Focus on precise measurements, circuit building, and understanding the ''''why'''' behind each experiment. Document all lab work meticulously.
Tools & Resources
Lab manuals, Breadboards, Multimeters, Basic electronic components
Career Connection
Proficiency in basic lab work is directly applicable to entry-level roles in testing, assembly, and quality control, making graduates immediately productive in an industrial setting.
Develop Effective Communication- (Semester 1-2)
Actively engage in communication skills classes, focusing on both written and oral expression. Practice public speaking, participate in group discussions, and improve technical writing, as clear communication is vital in any engineering role.
Tools & Resources
Grammarly, Toastmasters (if available), English speaking clubs, Online news articles
Career Connection
Strong communication skills are highly valued by Indian employers, improving chances in interviews, team collaboration, and client interaction, often differentiating candidates for promotions.
Intermediate Stage
Build Mini-Projects & Circuit Simulations- (Semester 3-4)
Beyond lab assignments, actively build small electronics projects using microcontrollers (e.g., Arduino, 8051) and simulate circuits for subjects like Analog and Digital Electronics. This hands-on application solidifies theoretical knowledge.
Tools & Resources
Arduino/8051 kits, Proteus, LTSpice, Tinkercad, Online tutorials
Career Connection
Practical project experience is a key differentiator in Indian placements, demonstrating problem-solving abilities and a genuine interest in the field, crucial for roles in embedded systems or hardware development.
Seek Early Industry Exposure- (Semester 3-4)
Actively participate in any industrial visits, workshops, or guest lectures organized by the department. Try to secure short-term internships or apprenticeships during semester breaks to understand real-world engineering challenges and workplace dynamics.
Tools & Resources
College placement cell, LinkedIn, Internshala, Industry contacts
Career Connection
Early exposure provides a realistic understanding of industry demands, helps in networking, and often leads to better performance in final year projects and enhanced placement opportunities in Indian companies.
Participate in Technical Competitions- (Semester 3-4)
Form teams and participate in inter-college or intra-college technical competitions, hackathons, or robotics challenges. This fosters innovative thinking, teamwork, and provides a platform to apply learned concepts creatively.
Tools & Resources
Robotics clubs, Technical fests, IEEEXtreme (if applicable), Hackerearth challenges
Career Connection
Such participations enhance your resume, showcase practical skills, and demonstrate initiative, which are highly regarded by recruiters for engineering roles in product development and R&D.
Advanced Stage
Specialize through Electives and Projects- (Semester 5-6)
Carefully choose your elective subjects based on your career interests (e.g., Mobile Communication, Embedded Systems). Invest significant effort in your final year project (Project Work II and III), aiming for an innovative and functional prototype that solves a real-world problem.
Tools & Resources
Advanced microcontrollers/FPGAs, DSP kits, Industry standards documentation, Mentors
Career Connection
Specialization makes you a desirable candidate for specific roles in telecom, defense, or automation sectors. A strong project acts as a portfolio, often directly leading to job offers or entrepreneurial ventures.
Intensive Placement Preparation- (Semester 5-6)
Begin intensive preparation for campus placements well in advance. This includes technical aptitude tests, revising core ECE concepts, practicing coding (if required), and developing strong interview skills, including mock interviews.
Tools & Resources
Placement cell resources, Online aptitude tests (IndiaBix), GeeksforGeeks for technical Q&A, Company-specific previous year papers
Career Connection
Thorough preparation directly impacts placement success, helping secure roles in top Indian and MNC companies and ensuring a strong start to your professional journey.
Network and Stay Updated- (Semester 5-6)
Actively network with alumni, faculty, and industry professionals. Attend industry seminars, workshops, and exhibitions. Stay updated with the latest technological advancements in ECE through journals, tech blogs, and online courses relevant to your chosen domain.
Tools & Resources
LinkedIn, Professional bodies (IEI, IETE), Tech conferences, NPTEL/Coursera courses
Career Connection
Networking opens doors to hidden job opportunities and mentorship. Staying updated ensures long-term career growth, adaptability to new technologies, and a competitive edge in the fast-paced Indian electronics industry.
Program Structure and Curriculum
Eligibility:
- 10th Passed (as per SKIET admission criteria)
Duration: 3 years / 6 semesters
Credits: 191 Credits
Assessment: Internal: undefined, External: undefined
Semester-wise Curriculum Table
Semester 1
| Subject Code | Subject Name | Subject Type | Credits | Key Topics |
|---|---|---|---|---|
| 1.1 | Applied Physics – I | Core | 4 | Units, Dimensions, Measurement, Force and Motion, Work, Power, Energy, Rotational Motion, Properties of Matter, Heat and Thermodynamics |
| 1.2 | Applied Chemistry | Core | 4 | Atomic Structure and Chemical Bonding, Water Treatment, Corrosion and its Prevention, Fuels and Lubricants, Polymers and Plastics, Environmental Chemistry |
| 1.3 | Applied Mathematics – I | Core | 4 | Algebra (Arithmetic & Geometric Progressions), Complex Numbers, Determinants and Matrices, Binomial Theorem, Vectors, Trigonometry |
| 1.4 | Communication Skills – I | Core | 3 | Communication Process, Grammar Basics, Vocabulary Building, Paragraph Writing, Letter Writing, Report Writing |
| 1.5 | Engineering Drawing | Core | 4 | Drawing Instruments and Conventions, Geometrical Constructions, Orthographic Projections, Isometric Projections, Sectional Views, Machine Drawing Basics |
| 1.6 | Applied Physics Lab – I | Lab | 2 | Measurement techniques, Study of moments of inertia, Determination of Young''''s Modulus, Surface tension experiments, Viscosity determination, Specific heat measurement |
| 1.7 | Applied Chemistry Lab | Lab | 2 | Volumetric analysis (acid-base, redox), Water hardness determination, Corrosion rate measurement, Flash and fire point of lubricants, Polymer synthesis observation, pH measurement |
| 1.8 | Computer Fundamentals & Applications Lab | Lab | 2 | Operating system basics, MS Office suite (Word, Excel, PowerPoint), Internet browsing and email, File management, Basic troubleshooting, Computer peripherals |
| 1.9 | Communication Skills Lab – I | Lab | 2 | Pronunciation practice, Role-playing conversations, Group discussions, Presentation skills, Listening comprehension, Interview techniques |
| 1.10 | General Workshop Practice – I | Lab | 2 | Carpentry tools and joints, Fitting tools and operations, Welding processes (Arc, Gas), Sheet metal work, Soldering and brazing, Safety practices |
Semester 2
| Subject Code | Subject Name | Subject Type | Credits | Key Topics |
|---|---|---|---|---|
| 2.1 | Applied Physics – II | Core | 4 | Wave Motion and its Applications, Sound and Acoustics, Optics (Refraction, Reflection), Electrostatics, Current Electricity, Electromagnetism |
| 2.2 | Applied Mathematics – II | Core | 4 | Differential Calculus, Integral Calculus, Differential Equations, Coordinate Geometry (2D, 3D), Probability and Statistics, Numerical Methods |
| 2.3 | Elements of Electrical Engg. | Core | 4 | DC Circuits (Ohm''''s Law, Kirchhoff''''s Laws), AC Fundamentals (RMS, Average Value), Three-Phase Systems, Transformers, DC Motors and Generators, AC Motors |
| 2.4 | Electronics Components & Materials | Core | 4 | Passive Components (Resistors, Capacitors, Inductors), Semiconductor Materials, Diodes (PN Junction, Zener), Transistors (BJT, FET), Integrated Circuits (Basic types), Special Purpose Devices |
| 2.5 | Communication Skills – II | Core | 3 | Oral Communication, Non-verbal Communication, Public Speaking, Interview Skills, Formal Presentation, Cross-cultural Communication |
| 2.6 | Applied Physics Lab – II | Lab | 2 | Measurement of focal length of lenses, Refractive index determination, Verification of Ohm''''s Law, Study of Wheatstone Bridge, Semiconductor diode characteristics, Transistor characteristics |
| 2.7 | Computer Programming Lab | Lab | 2 | C Programming fundamentals, Variables and data types, Control statements (if-else, loops), Functions and arrays, Strings, Basic data structures |
| 2.8 | Elements of Electrical Engg. Lab | Lab | 2 | Verification of Kirchhoff''''s laws, Study of RLC circuits, Transformer testing, Characteristics of DC machines, Characteristics of AC motors, Power factor improvement |
| 2.9 | Communication Skills Lab – II | Lab | 2 | Extempore speeches, Debates, Mock interviews, Technical presentation practice, Writing official emails, Resume building |
| 2.10 | General Workshop Practice – II | Lab | 2 | Machining operations (Lathe, Drilling), Foundry practice, Plumbing tools and connections, Fitting practice on complex jobs, Basic electrical wiring, Plastic molding |
Semester 3
| Subject Code | Subject Name | Subject Type | Credits | Key Topics |
|---|---|---|---|---|
| 3.1 | Analog Electronics | Core | 4 | Rectifiers and Filters, Voltage Regulators, Transistor Biasing and Amplifiers, Feedback Amplifiers, Oscillators, Operational Amplifiers |
| 3.2 | Electronic Instruments & Measurements | Core | 4 | Measurement Fundamentals, Analog and Digital Meters, Cathode Ray Oscilloscope (CRO), Signal Generators, Transducers, Data Acquisition Systems |
| 3.3 | Electronic Devices & Circuits | Core | 4 | PN Junction Diode characteristics, Zener Diode and its applications, Bipolar Junction Transistors (BJTs), Field Effect Transistors (FETs), SCR, TRIAC, DIAC, Opto-electronic Devices |
| 3.4 | Digital Electronics | Core | 4 | Number Systems and Codes, Boolean Algebra and Logic Gates, Combinational Logic Circuits, Sequential Logic Circuits (Flip-Flops), Registers and Counters, A/D and D/A Converters |
| 3.5 | Computer Hardware & Networks | Core | 4 | Computer Architecture, Memory Organization, Input/Output Devices, Networking Fundamentals (OSI Model), Network Topologies, Network Security Basics |
| 3.6 | Analog Electronics Lab | Lab | 2 | Rectifier and filter circuit analysis, Zener voltage regulator design, Transistor amplifier characteristics, Feedback amplifier circuits, RC phase shift and Wien bridge oscillators, Op-amp applications |
| 3.7 | Electronic Instruments & Measurements Lab | Lab | 2 | Calibration of meters, CRO operation and measurements, Function generator usage, Measurement of L, C, R, Strain gauge measurement, Temperature sensor calibration |
| 3.8 | Digital Electronics Lab | Lab | 2 | Verification of logic gates, Design of combinational circuits (adders, multiplexers), Flip-flop implementation, Counters and shift registers, Encoder/decoder circuits, A/D and D/A converter interfacing |
| 3.9 | Computer Hardware & Networks Lab | Lab | 2 | PC assembly and disassembly, OS installation, Network cable crimping, Network configuration (IP addressing), Troubleshooting network issues, Printer installation and sharing |
| 3.10 | Generic Skill & Entrepreneurship Development | Skill | 3 | Personal Effectiveness, Time Management, Teamwork, Entrepreneurship Basics, Business Plan Development, Marketing Strategies |
Semester 4
| Subject Code | Subject Name | Subject Type | Credits | Key Topics |
|---|---|---|---|---|
| 4.1 | Communication Systems | Core | 4 | Amplitude Modulation (AM), Frequency Modulation (FM), Phase Modulation (PM), Pulse Modulation (PAM, PPM, PWM), Digital Communication Concepts, Noise in Communication Systems |
| 4.2 | Microcontrollers | Core | 4 | Microprocessor vs Microcontroller, 8051 Microcontroller Architecture, 8051 Instruction Set, Assembly Language Programming, Interfacing I/O Devices, Timers and Serial Communication |
| 4.3 | Power Electronics | Core | 4 | Power Semiconductor Devices (SCR, DIAC, TRIAC, MOSFET, IGBT), Controlled Rectifiers, Choppers, Inverters, Cycloconverters, DC to DC Converters |
| 4.4 | Network Filters & Transmission Lines | Core | 4 | Two-Port Networks, Filter Design (Low-pass, High-pass, Band-pass), Attenuation and Phase Equalizers, Transmission Line Parameters, Characteristic Impedance, Standing Wave Ratio (SWR) |
| 4.5 | Basic Management Skills | Core | 3 | Principles of Management, Planning and Organizing, Motivation and Leadership, Marketing Fundamentals, Financial Management Basics, Industrial Relations |
| 4.6 | Communication Systems Lab | Lab | 2 | AM and FM modulation/demodulation, Pulse modulation techniques, Sampling and reconstruction, Line coding schemes, Noise effects in communication, Antenna characteristics |
| 4.7 | Microcontrollers Lab | Lab | 2 | 8051 programming in assembly and C, LED interfacing, Seven-segment display interfacing, LCD interfacing, Keypad interfacing, ADC/DAC interfacing |
| 4.8 | Power Electronics Lab | Lab | 2 | SCR characteristics and triggering, Half-wave and full-wave controlled rectifiers, Chopper circuits, Inverter circuits, Commutation techniques, TRIAC/DIAC circuits |
| 4.9 | Project Work – I | Project | 4 | Problem identification and scope definition, Literature review, System design and block diagrams, Component selection, Basic circuit implementation, Report writing and presentation |
| 4.10 | Industrial Training – I (4 weeks after 4th Sem) | Internship | 4 | Exposure to industry environment, Practical application of theoretical knowledge, Understanding organizational structure, Developing professional ethics, Report on industrial processes, Problem-solving in real-world settings |
Semester 5
| Subject Code | Subject Name | Subject Type | Credits | Key Topics |
|---|---|---|---|---|
| 5.1 | Industrial Electronics | Core | 4 | Industrial Control Systems, Transducers and Sensors, Programmable Logic Controllers (PLCs), Robotics Basics, SCADA Systems, Motor Control Circuits |
| 5.2 | Micro Wave & Radar Engineering | Core | 4 | Microwave Devices (Klystron, Magnetron), Waveguides and Resonators, Microwave Components, Radar Equation, Radar Systems (CW, Pulsed), Radar Applications |
| 5.3 | Embedded System | Core | 4 | Introduction to Embedded Systems, Embedded Microcontrollers (e.g., PIC, ARM), Real-time Operating Systems (RTOS), Embedded C Programming, Interfacing Peripherals, Debugging and Testing |
| 5.4 | Optical Fiber Communication | Core | 4 | Optical Fiber Structure and Types, Light Sources (LED, Laser Diodes), Optical Detectors (PIN, APD), Optical Amplifiers, Fiber Optic Communication System, Optical Network Components |
| 5.5 | Consumer Electronics | Core | 4 | Audio Systems, Video Systems (TV, CCTV), Digital Camera Technology, Mobile Phone Systems, Home Appliances (Microwave Oven, Washing Machine), Maintenance and Troubleshooting |
| 5.6 | Industrial Electronics Lab | Lab | 2 | Motor speed control circuits, PLC programming (ladder logic), Transducer interfacing and calibration, Relay and contactor control, SCR/TRIAC applications in industrial control, Temperature/light control systems |
| 5.7 | Micro Wave & Radar Engineering Lab | Lab | 2 | Characteristics of Klystron/Gunn diode, Measurement of VSWR, Study of directional couplers, Antenna radiation pattern measurement, Radar system simulation, Microwave power measurement |
| 5.8 | Embedded System Lab | Lab | 2 | Embedded C programming for microcontrollers, Interfacing sensors and actuators, Timer and interrupt programming, Serial communication (UART, SPI, I2C), Real-time clock integration, Mini-project development |
| 5.9 | Optical Fiber Communication Lab | Lab | 2 | Fiber optic cable characteristics, Numerical Aperture measurement, Attenuation measurement in optical fibers, LED/Laser diode characteristics, Optical detector characteristics, Establishment of optical link |
| 5.10 | Project Work – II | Project | 6 | Advanced system design and implementation, Hardware-software integration, Testing and debugging, Performance analysis, Documentation and report writing, Presentation and demonstration |
| 5.11 | Industrial Visit | Practical | 1 | Observation of industrial processes, Interaction with industry professionals, Understanding manufacturing practices, Exposure to modern technologies, Learning about quality control, Report submission on visit experience |
Semester 6
| Subject Code | Subject Name | Subject Type | Credits | Key Topics |
|---|---|---|---|---|
| 6.1 | Modern Communication Systems | Core | 4 | Cellular Communication (GSM, CDMA), Satellite Communication, GPS and Navigation Systems, Wireless Technologies (Wi-Fi, Bluetooth), Data Communication Networks, Internet of Things (IoT) basics |
| 6.2 | VLSI & DSP | Core | 4 | VLSI Design Flow, MOSFET Fundamentals, CMOS Logic Circuits, Digital Signal Processing (DSP) Basics, FIR and IIR Filters, DSP Processors |
| 6.3 | Medical Electronics | Core | 4 | Bio-potentials and Electrodes, Biomedical Transducers, Electrocardiography (ECG), Electroencephalography (EEG), Medical Imaging Systems (X-ray, MRI), Therapeutic Equipment |
| 6.4 | Elective (Mobile Communication OR Advance Microcontroller OR PLC SCADA) | Elective | 4 | Mobile Communication: Cellular Concepts, GSM, GPRS, EDGE, 3G/4G/5G Architectures, Advance Microcontroller: ARM Architecture, PIC Microcontrollers, Memory Interfacing, Peripherals, PLC SCADA: PLC Programming, SCADA Systems, HMI, Industrial Automation |
| 6.5 | Modern Communication Systems Lab | Lab | 2 | GSM/CDMA mobile communication setup, Satellite communication link establishment, GPS receiver interfacing, Wi-Fi and Bluetooth module interfacing, Data network configuration, IoT device connectivity |
| 6.6 | VLSI & DSP Lab | Lab | 2 | VLSI design using Verilog/VHDL, FPGA programming, DSP algorithm implementation, Filter design and analysis, DFT/FFT algorithms, DSP processor interfacing |
| 6.7 | Medical Electronics Lab | Lab | 2 | Measurement of bio-potentials (ECG, EEG), Biomedical sensor interfacing, Designing amplifier for bio-signals, Study of medical imaging principles, Operation of medical diagnostic equipment, Safety in medical electronics |
| 6.8 | Project Work – III | Project | 8 | Prototype development and advanced testing, Real-world problem solving with innovative solutions, Complex system integration, Economic feasibility analysis, Comprehensive documentation and final report, Public presentation and defense |
| 6.9 | Industrial Training – II (4 weeks after 6th Sem) | Internship | 4 | Specialized skill development in chosen area, Participation in industry projects, Understanding advanced industrial practices, Professional networking, Career guidance and mentorship, Detailed report on training experience and learning outcomes |
