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PG-DIPLOMA in Semiconductor Device Packaging Pgdsdp at Shri Vishwakarma Skill University
Palwal, Haryana
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About the Specialization
What is Semiconductor Device Packaging (PGDSDP) at Shri Vishwakarma Skill University Palwal?
This Postgraduate Diploma in Semiconductor Device Packaging (PGDSDP) program at Shri Vishwakarma Skill University focuses on equipping students with advanced skills in semiconductor packaging. Given India''''s growing semiconductor manufacturing ecosystem and the ''''Make in India'''' initiative, this specialization is crucial for developing a skilled workforce. The program emphasizes an industry-aligned curriculum and practical training to meet the dynamic demands of the semiconductor packaging industry in India.
Who Should Apply?
This program is ideal for engineering graduates (B.Tech/BE in ECE, EEE, Instrumentation, etc.) or M.Sc in Electronics/Physics aiming to enter the high-growth semiconductor sector. It also caters to working professionals seeking to upskill in advanced packaging technologies and career changers transitioning into specialized roles within electronics manufacturing and design. A solid foundation in electronics or physics is a prerequisite for optimal benefit.
Why Choose This Course?
Graduates of this program can expect promising career paths in semiconductor assembly and test, R&D, and quality control roles within India''''s burgeoning electronics manufacturing companies and MNCs. Entry-level salaries typically range from INR 4-7 lakhs per annum, with significant growth potential up to INR 10-15+ lakhs for experienced professionals. The skills acquired align with industry demands for packaging engineers and process specialists, fostering vital contributions to the nation''''s tech landscape.
Student Success Practices
Foundation Stage
Master Semiconductor Fundamentals and Lab Skills- (Semester 1)
Dedicate significant time to thoroughly understand the foundational concepts of semiconductor materials, device physics, and basic packaging principles. Maximize practical learning opportunities in Lab-I, focusing on precision in wafer dicing, die bonding, and wire bonding techniques. Utilize textbooks, online courses, and lab manuals to build a strong theoretical base and refine practical competencies.
Tools & Resources
NPTEL courses on VLSI/Semiconductor Devices, lab equipment (dicing saw, die bonder, wire bonder), microscopes, data sheets
Career Connection
A solid foundation in these core areas and practical proficiency is essential for understanding advanced packaging challenges and excelling in technical interviews for R&D, process engineering, and manufacturing roles in India.
Engage with Industry Trends through Electives- (Semester 1)
Actively explore the ''''Value Added Course'''' options (e.g., Green Packaging, Basics of IoT). Delve into current industry trends through tech news, webinars, and relevant online forums specific to your chosen elective. This broadens your perspective beyond core subjects and helps identify areas for future specialization within the Indian electronics industry.
Tools & Resources
Industry publications (IEEE Spectrum, Semiconductor Engineering), LinkedIn Learning, specific online courses for IoT or sustainable engineering, tech blogs
Career Connection
Staying updated on industry trends and adjacent technologies enhances adaptability and provides valuable talking points in interviews, showcasing a holistic understanding of the semiconductor ecosystem and future-readiness.
Build Problem-Solving Mindset- (Semester 1)
Approach each theory and practical challenge with a problem-solving mindset. Break down complex problems into smaller, manageable parts. Discuss concepts with peers and instructors to deepen understanding. Focus on ''''why'''' and ''''how'''' behind processes rather than just memorizing steps to develop critical thinking skills essential for innovation.
Tools & Resources
Textbooks, case studies, group discussions, whiteboards
Career Connection
A strong problem-solving ability is highly sought after by Indian companies in R&D, process improvement, and troubleshooting roles, enabling graduates to contribute effectively to manufacturing challenges.
Intermediate Stage
Specialize in Advanced Packaging & EDA Tools- (Semester 2)
Deepen your understanding of advanced packaging technologies like 3D IC, SiP, and WLP. Simultaneously, gain hands-on proficiency in Electronic Design Automation (EDA) tools for package design and simulation. Practice using these tools for signal integrity, power integrity, and thermal analysis problems to simulate real-world scenarios.
Tools & Resources
Ansys (SiP, thermal), Cadence (packaging design), MATLAB, advanced textbooks on 3D integration
Career Connection
Expertise in advanced packaging concepts and EDA tools is critical for specialized roles in design, R&D, and simulation engineering within leading semiconductor firms and design houses in India, offering high-value career paths.
Undertake an Industry-Relevant Project- (Semester 2)
Leverage the ''''Project'''' course to work on a problem directly relevant to the semiconductor packaging industry in India. This could involve designing a package, simulating its thermal performance, or evaluating a new material. Focus on problem identification, robust methodology, accurate data interpretation, and effective communication of results.
Tools & Resources
Access to university labs, simulation software, academic research papers, industry mentors (if available), project report guidelines
Career Connection
A well-executed project demonstrates independent research capabilities, problem-solving skills, and practical application of knowledge, making graduates highly attractive to potential employers for technical and innovation roles.
Network and Prepare for Placements Effectively- (Semester 2)
Actively participate in workshops, seminars, and guest lectures to network with industry professionals and understand current industry demands in India. Prepare a professional resume tailored to the semiconductor sector, practice technical and HR interviews, and attend campus placement drives and job fairs. Seek guidance from career services for targeted job search strategies.
Tools & Resources
LinkedIn, university career cell, mock interview platforms, company websites of Indian and MNC semiconductor firms, job portals (Naukri, LinkedIn Jobs)
Career Connection
Effective networking can lead to referrals and insights, while strong interview preparation significantly increases the chances of securing desirable placement offers in leading semiconductor companies contributing to India''''s tech ecosystem.
Advanced Stage
Program Structure and Curriculum
Eligibility:
- B.Tech/BE in ECE/EEE/Instrumentation/Mechatronics/Electrical/Electronics & Comm./Electronics and Computer Engineering/Applied Electronics/Industrial Electronics/Power Electronics or M.Sc in Electronics/Physics with Electronics specialization/Material Science with 50% Marks for General Category (45% for SC/ST/PwD/OBC-NCL of Haryana Domicile).
Duration: 1 year (2 semesters)
Credits: 32 Credits
Assessment: Internal: 40%, External: 60%
Semester-wise Curriculum Table
Semester 1
| Subject Code | Subject Name | Subject Type | Credits | Key Topics |
|---|---|---|---|---|
| SSP-101 | Introduction to Semiconductor Technology & Packaging | Core | 4 | Semiconductor Materials and Devices, Basic Packaging Concepts and Evolution, Wafer Fabrication Processes Overview, Interconnect Technologies Fundamentals, Cleanroom Environment and Safety, Reliability and Quality in Packaging |
| SSP-102 | Packaging Materials and Processes | Core | 4 | Substrate Materials (PCB, Ceramic, Leadframe), Encapsulants and Adhesives, Interconnection Materials and Selection, Wafer Dicing and Die Attach Processes, Wire Bonding Technologies (Gold, Copper), Flip Chip and TSV Packaging Concepts |
| SSP-103 | Thermal Management & Reliability of Electronic Packages | Core | 4 | Heat Transfer Principles in Electronics, Thermal Resistance Models and Analysis, Cooling Technologies (Heat Sinks, Liquid Cooling), Failure Mechanisms in Electronic Packages, Reliability Testing and Standards, Stress Analysis and Lifetime Prediction |
| SSP-104L | Semiconductor Device Packaging Lab - I | Lab | 3 | Wafer Dicing Practice, Die Bonding Techniques (Epoxy, Solder), Wire Bonding Operations and Characterization, Encapsulation Procedures, Basic Package Assembly Processes, Metrology and Visual Inspection |
| SSP-105A | Communication & Soft Skills (Value Added Course - I Elective) | Elective | 3 | Verbal and Non-Verbal Communication, Presentation Skills and Public Speaking, Group Discussion Techniques, Interview Preparation and Etiquette, Professional Ethics and Workplace Communication |
| SSP-105B | Basics of IoT (Value Added Course - I Elective) | Elective | 3 | IoT Architecture and Communication Protocols, Sensors, Actuators, and Embedded Systems, Data Acquisition and Analytics in IoT, IoT Security and Cloud Integration, Smart Applications and Case Studies |
| SSP-105C | Green Packaging (Value Added Course - I Elective) | Elective | 3 | Environmental Regulations in Packaging, Sustainable Packaging Materials and Selection, Life Cycle Assessment of Packages, Eco-design Principles for Electronics, Recycling and Waste Management Strategies |
Semester 2
| Subject Code | Subject Name | Subject Type | Credits | Key Topics |
|---|---|---|---|---|
| SSP-201 | Advanced Packaging Technologies | Core | 4 | System-in-Package (SiP) Design, 3D IC and Wafer Level Packaging (WLP), Fan-out Wafer Level Packaging (FOWLP), Microelectromechanical Systems (MEMS) Packaging, Heterogeneous Integration Concepts, Advanced Substrate and Interconnect Technologies |
| SSP-202 | Electronic Design Automation (EDA) for Packaging | Core | 4 | Introduction to EDA Tools for Packaging, Package Design Flow and Methodologies, Signal Integrity Analysis and Mitigation, Power Integrity Analysis in Packages, Thermal Simulation Tools and Techniques, Electromagnetic Interference (EMI) Simulation |
| SSP-203L | Semiconductor Device Packaging Lab - II | Lab | 3 | Advanced Die Attach Techniques, Flip-Chip Assembly and Underfilling, Thermal Measurement Techniques for Packages, Package Reliability Testing and Characterization, Failure Analysis of Packaged Devices, EDA Tool Simulation Practice for Packaging |
| SSP-204 | Project | Project | 3 | Problem Identification and Scope Definition, Literature Review and Background Research, Methodology Design and Experimental Setup, Data Collection, Analysis, and Interpretation, Report Writing and Technical Presentation, Innovation and Real-world Application |
