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M-TECH in Digital Electronics And Communication at Acharya Institute of Technology
Bengaluru, Karnataka
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About the Specialization
What is Digital Electronics and Communication at Acharya Institute of Technology Bengaluru?
This Digital Electronics and Communication program at Acharya Institute of Technology focuses on advanced concepts in digital signal processing, communication systems, VLSI design, and embedded systems. It addresses the growing demand for skilled professionals in India''''s rapidly evolving electronics and telecommunication industries, emphasizing practical applications and theoretical depth. The curriculum is designed to produce innovators ready for cutting-edge technology.
Who Should Apply?
This program is ideal for engineering graduates with a background in Electronics & Communication, Telecommunication, or allied fields who are keen on specializing in next-generation communication and digital hardware design. It attracts fresh graduates aspiring to enter core tech roles and working professionals looking to upskill in areas like 5G, IoT, VLSI, or embedded systems to enhance their career trajectories in the Indian market.
Why Choose This Course?
Graduates of this program can expect promising career paths in R&D, design, and manufacturing roles within Indian and global tech companies. Potential roles include VLSI design engineer, embedded systems engineer, communication engineer, or DSP engineer. Entry-level salaries range from INR 6-10 LPA, with experienced professionals earning upwards of INR 15-30 LPA, driven by India''''s thriving semiconductor and telecom sectors. The program also prepares students for advanced research or entrepreneurship.
Student Success Practices
Foundation Stage
Strengthen Core Concepts with Online Resources- (Semester 1-2)
Dedicate time to revisit and deepen understanding of fundamental topics like advanced mathematics, digital communication, and VLSI basics. Utilize free online courses and problem-solving platforms to reinforce classroom learning.
Tools & Resources
NPTEL courses on VLSI and DSP, MIT OpenCourseWare, Coursera/edX for specialized topics, GeeksforGeeks for problem-solving
Career Connection
A strong foundation is critical for tackling advanced subjects and cracking technical interviews for core engineering roles. It enables quick learning of new technologies.
Build Practical Skills through Lab Work and Simulations- (Semester 1-2)
Actively engage in all laboratory sessions and explore beyond prescribed experiments. Use simulation tools to design and test digital circuits and communication systems, understanding their real-world behavior.
Tools & Resources
MATLAB/Simulink, Xilinx Vivado/Intel Quartus Prime (for HDL and FPGA), Cadence/Synopsis tools (if available in labs), SPICE for circuit simulation
Career Connection
Hands-on experience with industry-standard tools is highly valued by employers for roles in VLSI design, embedded systems development, and communication system engineering.
Participate in Technical Clubs and Mini-Projects- (Semester 1-2)
Join relevant technical clubs (e.g., Robotics, IoT, VLSI clubs) and undertake small-scale mini-projects. Collaborating with peers on practical implementations helps apply theoretical knowledge and develop teamwork skills.
Tools & Resources
College technical clubs, Local hackathons/competitions, Online project ideas from GitHub/Instructables
Career Connection
These activities build a portfolio of practical work, showcase initiative, and develop problem-solving abilities, which are crucial for internships and job applications.
Intermediate Stage
Undertake Industry-Relevant Certifications- (Semester 3)
Pursue certifications in high-demand areas like embedded systems, advanced DSP, or specific VLSI tools. This demonstrates specialized expertise beyond the curriculum.
Tools & Resources
ARM certification, Texas Instruments DSP certification, Nvidia Deep Learning Institute certifications, Online platforms offering specialized courses and certifications
Career Connection
Certifications validate skills for specific job roles, making candidates more competitive for specialized positions in core industries and potentially commanding higher salaries.
Network with Professionals and Attend Workshops- (Semester 3)
Actively seek opportunities to attend industry workshops, seminars, and conferences (virtual or in-person). Connect with faculty, alumni, and industry experts to gain insights and identify potential mentorships or collaborations.
Tools & Resources
LinkedIn, Professional conferences (IEEE, ACM events), Industry meetups organized by local tech hubs
Career Connection
Networking opens doors to internship and placement opportunities, provides mentorship, and keeps students updated on industry trends and job market demands.
Focus on Internship for Practical Exposure- (Semester 3)
Secure a relevant internship during the program. Treat the internship as a serious learning opportunity, taking initiative to learn new tools, contribute to projects, and understand corporate culture.
Tools & Resources
College placement cell, Internship portals like Internshala, LinkedIn, Direct applications to companies
Career Connection
Internships are often a direct path to full-time employment and provide invaluable practical experience, making resumes stand out to prospective employers.
Advanced Stage
Excel in Project Work and Publications- (Semester 3-4)
Treat your M.Tech project as a research-level endeavor. Aim for impactful results, document thoroughly, and explore opportunities to publish findings in conferences or journals.
Tools & Resources
IEEE Xplore, SpringerLink, ResearchGate, Academic writing tools and LaTeX
Career Connection
A strong project and potential publications enhance your profile for R&D roles, PhD admissions, and differentiate you as an innovator capable of independent research and development.
Prepare Strategically for Placements- (Semester 4)
Start placement preparation early, focusing on technical aptitude, coding skills (if relevant for embedded/DSP roles), and behavioral interviews. Tailor your resume and cover letter to specific job descriptions.
Tools & Resources
Mock interviews with seniors/faculty, Placement training programs, Online coding platforms (HackerRank, LeetCode), Company-specific preparation guides
Career Connection
Thorough preparation directly increases the chances of securing desirable job offers from top companies during campus placements or off-campus drives.
Develop Leadership and Communication Skills- (Semester 4)
Engage in activities that foster leadership, presentation, and technical communication. This includes leading project teams, presenting research, and contributing to technical discussions.
Tools & Resources
Toastmasters International (or similar clubs), Public speaking workshops, Participation in national level project competitions
Career Connection
Beyond technical skills, strong soft skills are essential for career progression into leadership and management roles, making you a well-rounded professional.
Program Structure and Curriculum
Eligibility:
- B.E./B.Tech. in Electronics and Communication Engineering (ECE), Electronics and Instrumentation Engineering (EIE), Telecommunication Engineering or an equivalent degree as per the eligibility criteria of VTU/PGCET/AICTE.
Duration: 4 semesters / 2 years
Credits: 80 Credits
Assessment: Internal: 50%, External: 50%
Semester-wise Curriculum Table
Semester 1
| Subject Code | Subject Name | Subject Type | Credits | Key Topics |
|---|---|---|---|---|
| 22DEC11 | Advanced Engineering Mathematics | Core | 4 | Linear Algebra, Calculus of Variations, Probability Theory, Random Variables, Stochastic Processes, Numerical Methods |
| 22DEC12 | Advanced Digital Communication | Core | 4 | Digital Modulation Techniques, Optimum Receivers, Channel Coding, Spread Spectrum Communication, Multi-User and Multi-Path Channels, Adaptive Equalization |
| 22DEC13 | Advanced Digital System Design | Core | 4 | HDL for Digital Design, Combinational Logic Design, Sequential Logic Design, Finite State Machines, Clocking and Timing Issues, Design for Testability |
| 22DEC141 | Advanced Embedded Systems | Program Elective – I | 4 | Embedded System Architecture, Real-Time Operating Systems, Embedded Networking, Hardware-Software Co-design, Embedded System Debugging, IoT Integration |
| 22DECL15 | DEC Laboratory – I (Analog and Digital Lab) | Core Lab | 2 | Analog IC Design, Digital IC Implementation, FPGA Based Design, High-Frequency Circuit Simulation, Power Amplifier Design, Analog and Digital Interface |
| 22DEC16 | Research Methodology and IPR | Mandatory Course | 2 | Research Problem Formulation, Research Design, Data Collection and Analysis, Technical Writing, Intellectual Property Rights, Patent Filing |
Semester 2
| Subject Code | Subject Name | Subject Type | Credits | Key Topics |
|---|---|---|---|---|
| 22DEC21 | Advanced VLSI Design | Core | 4 | CMOS Technology, MOSFET Scaling, Digital CMOS Circuits, Subsystem Design, Memory and Array Structures, Clocking Strategies |
| 22DEC22 | Wireless Communication and Networks | Core | 4 | Cellular Concept, Mobile Radio Propagation, Multiple Access Techniques, Wireless LANs, 5G Communication, Security in Wireless Networks |
| 22DEC231 | Advanced DSP | Program Elective – II | 4 | Multirate Digital Signal Processing, Adaptive Filters, Wavelet Transforms, Speech Processing, Image and Video Processing, DSP Architectures |
| 22DEC241 | FPGA Based System Design | Program Elective – III | 4 | FPGA Architectures, HDL for FPGA, FPGA Design Flow, High-Level Synthesis, Embedded Processors in FPGA, FPGA for Signal Processing |
| 22DECL25 | DEC Laboratory – II (Digital Communication and VLSI Lab) | Core Lab | 2 | Digital Modulation Experiments, Channel Coding Implementation, OFDM Transceiver, VLSI Design Tools, ASIC Design Flow, System-on-Chip Implementation |
| 22DEC26 | Technical Seminar | Core | 2 | Literature Survey, Research Paper Presentation, Technical Report Writing, Communication Skills, Peer Review, Latest Technological Advancements |
Semester 3
| Subject Code | Subject Name | Subject Type | Credits | Key Topics |
|---|---|---|---|---|
| 22DEC31 | Project Work Phase - I | Core | 6 | Problem Identification, Literature Review, Methodology Development, Initial Design, Feasibility Study, Report Writing |
| 22DEC321 | Internet of Things | Program Elective – IV | 4 | IoT Architecture, Sensors and Actuators, IoT Communication Protocols, Cloud Platforms for IoT, Edge Computing, IoT Security and Privacy |
| 22DEC33 | Internship | Core | 10 | Industry Exposure, Practical Skill Application, Professional Networking, Project Implementation, Problem Solving in Real-World Scenarios, Corporate Culture Adaptation |
Semester 4
| Subject Code | Subject Name | Subject Type | Credits | Key Topics |
|---|---|---|---|---|
| 22DEC41 | Project Work Phase - II | Core | 20 | System Implementation, Testing and Validation, Performance Analysis, Optimization Techniques, Technical Documentation, Research Publication |
