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M-TECH in Vlsi Design at SRM Institute of Science and Technology
Chengalpattu, Tamil Nadu
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About the Specialization
What is VLSI Design at SRM Institute of Science and Technology Chengalpattu?
This VLSI Design program at SRM Institute of Science and Technology focuses on equipping students with advanced knowledge in integrated circuit design, encompassing digital, analog, and mixed-signal domains. With India''''s burgeoning semiconductor industry and design houses, the program addresses the critical demand for skilled VLSI engineers, emphasizing practical design, verification, and testing methodologies crucial for indigenous and global product development.
Who Should Apply?
This program is ideal for engineering graduates with a B.E./B.Tech in ECE, EEE, or similar disciplines, aspiring to build careers in the semiconductor industry. It also caters to working professionals seeking to upskill in cutting-edge VLSI technologies, or career changers aiming to transition into the high-demand field of chip design, leveraging their foundational electronics knowledge.
Why Choose This Course?
Graduates can expect diverse career paths in India as ASIC/FPGA Designers, Verification Engineers, Layout Engineers, or Analog Design Engineers at leading semiconductor companies. Entry-level salaries typically range from INR 6-10 LPA, with experienced professionals earning significantly higher. The program facilitates growth into senior design roles and aligns with industry certifications, enhancing global employability.
Student Success Practices
Foundation Stage
Strengthen Digital and Analog Fundamentals- (Semester 1-2)
Focus on mastering core concepts in Advanced Digital System Design and Analog Integrated Circuit Design. Utilize online platforms like NPTEL courses, Coursera''''s VLSI specializations, and classic textbooks. This foundational knowledge is crucial for understanding complex chip design and excelling in technical interviews.
Tools & Resources
NPTEL courses, Coursera, Textbooks by Neil Weste, David Johns, Behzad Razavi
Career Connection
Develops strong conceptual understanding required for entry-level design and verification engineering roles.
Hands-on EDA Tool Proficiency- (Semester 1-2)
Develop practical skills by dedicating extra time to VLSI labs. Become proficient with industry-standard EDA tools such as Cadence Virtuoso, Synopsis Design Compiler, Xilinx Vivado, and Mentor Graphics QuestaSim. Participating in tool workshops and mini-projects significantly enhances practical experience for placement drives.
Tools & Resources
Cadence Virtuoso, Synopsys Design Compiler, Xilinx Vivado, Mentor Graphics QuestaSim
Career Connection
Directly applicable to VLSI design, verification, and layout engineering roles, making candidates job-ready.
Active Peer Learning and Problem Solving- (Semester 1-2)
Form study groups to discuss complex topics, solve design challenges, and prepare for exams collaboratively. Engage in online forums dedicated to electronics and VLSI for broader exposure. Regularly practice problem-solving exercises from standard textbooks and simulation-based tasks to build critical thinking.
Tools & Resources
Study groups, Online forums (StackExchange, EDAboard), Textbook problem sets
Career Connection
Enhances conceptual clarity, problem-solving abilities, and communication skills, vital for team-based industry projects.
Intermediate Stage
Specialized Skill Development through Electives- (Semester 2-3)
Strategically choose elective courses that align with specific career interests within VLSI, such as SoC Design for embedded systems or Low Power VLSI Design for mobile applications. Deep dive into these chosen areas using advanced textbooks and research papers to build niche expertise.
Tools & Resources
Advanced textbooks, IEEE/ACM research papers, Specialized online courses
Career Connection
Develops expertise in specific high-demand VLSI domains, making candidates attractive for specialized roles in the Indian semiconductor market.
Industry Exposure through Internships and Projects- (Semester 2-3)
Actively seek internships at leading semiconductor companies (e.g., Intel, AMD, Qualcomm, Synopsis, Cadence in India) during academic breaks. Engage in challenging academic projects that simulate real-world design flows under faculty guidance. These experiences are invaluable for practical learning and securing placements.
Tools & Resources
Company career portals, University placement cell, Faculty research labs
Career Connection
Provides real-world experience, builds professional networks, and significantly improves placement opportunities with top companies.
Build a Strong Technical Portfolio- (Semester 2-3)
Document all design projects, lab assignments, and mini-projects thoroughly. Showcase design choices, verification methodologies, simulation results, and challenges faced. Maintain a well-curated GitHub repository with Verilog/VHDL code and project reports as a powerful portfolio during placement drives.
Tools & Resources
GitHub, Project documentation templates, Personal website/blog
Career Connection
Visually demonstrates practical application skills and problem-solving abilities to potential employers during interviews.
Advanced Stage
Comprehensive Project Work and Research- (Semester 3-4)
Dedicate significant effort to the M.Tech Project Work (Phase I & II), aiming for a novel contribution, a complex system implementation, or research paper publication. Utilize current research from IEEE/ACM conferences (e.g., DAC, ICCAD, VLSI Design) to guide the project. A strong project can open doors to R&D roles.
Tools & Resources
IEEE Xplore, ACM Digital Library, Scopus/Web of Science, LaTeX for report writing
Career Connection
Leads to potential publications, demonstrates advanced research capabilities, and qualifies for specialized R&D or senior design positions.
Rigorous Placement Preparation and Mock Interviews- (Semester 3-4)
Begin rigorous placement preparation well in advance, focusing on technical aptitude, core VLSI concepts, digital design interview questions, and HR interview skills. Participate in mock interviews with faculty, alumni, and peers to refine communication and problem-solving under pressure.
Tools & Resources
InterviewBit, LeetCode (for logic/algorithms), VLSI interview prep guides, Alumni network
Career Connection
Crucial for securing placements in core VLSI companies, preparing for technical and behavioral assessments.
Network Building and Professional Development- (Semester 3-4)
Attend national and international conferences, seminars, and workshops related to VLSI design to stay updated with industry trends and emerging technologies. Connect with industry professionals and alumni on LinkedIn. Consider joining professional bodies like IEEE/IES for networking and continuous learning opportunities.
Tools & Resources
LinkedIn, IEEE/IES memberships, Conference calendars (VLSI Design, DAC)
Career Connection
Facilitates long-term career growth, mentorship opportunities, and access to advanced job prospects in the rapidly evolving semiconductor industry.
Program Structure and Curriculum
Eligibility:
- B.E./B.Tech. degree in Electronics and Communication Engineering / Electrical and Electronics Engineering / Electronics and Instrumentation Engineering / Computer Science and Engineering / Information Technology / Instrumentation and Control Engineering / Telecommunication Engineering / Mechatronics or M.Sc. (Electronics / Applied Electronics / Applied Sciences) with a minimum aggregate of 50%.
Duration: 2 years (4 semesters)
Credits: 74 Credits
Assessment: Internal: 50% (for theory courses), External: 50% (for theory courses)
Semester-wise Curriculum Table
Semester 1
| Subject Code | Subject Name | Subject Type | Credits | Key Topics |
|---|---|---|---|---|
| MVD21101 | Advanced Digital System Design | Core | 4 | Boolean Algebra and Logic Gates, Combinational and Sequential Circuit Design, Finite State Machines (FSM), VHDL/Verilog for Digital Design, Arithmetic Circuits and Memory, Programmable Logic Devices (PLDs) |
| MVD21102 | CMOS VLSI Design | Core | 4 | MOS Transistor Theory and Fabrication, CMOS Inverter and Logic Gates, Power Dissipation in CMOS Circuits, Layout Design Rules and Stick Diagrams, Design of Combinational and Sequential Circuits, Timing Analysis and Interconnect Effects |
| MVD21103 | Advanced Microprocessors and Microcontrollers | Core | 3 | Microprocessor Architectures (e.g., ARM Cortex), Instruction Set Architecture, Assembly Language, Memory and I/O Interfacing, Peripherals and Communication Protocols, Interrupts and Exception Handling, Embedded System Concepts |
| MVD21104 | VLSI Design Lab I | Lab | 2 | Digital IC Design using HDL, FPGA-based Prototyping, CMOS Circuit Simulation using SPICE, Layout Design using EDA Tools, Timing and Power Analysis of Digital Circuits, Verification Techniques |
| MVD211E1 | Embedded System Design | Elective | 3 | Embedded Processors and Architectures, Real-Time Operating Systems (RTOS), Firmware Design and Development, Debugging and Testing Embedded Systems, Interfacing and Communication Protocols, Embedded Linux and IoT Applications |
| RMC21001 | Research Methodology and IPR | Core | 3 | Research Problem Formulation, Literature Review and Data Collection Methods, Statistical Analysis and Hypothesis Testing, Technical Report Writing and Plagiarism, Intellectual Property Rights (IPR), Patent Filing Procedures and Ethics |
Semester 2
| Subject Code | Subject Name | Subject Type | Credits | Key Topics |
|---|---|---|---|---|
| MVD21201 | Analog Integrated Circuit Design | Core | 4 | MOS Amplifiers and Current Mirrors, Differential Amplifiers and Operational Amplifiers, Frequency Response and Feedback, Noise in Analog Circuits, Bandgap References and Voltage Regulators, Data Converters (ADC, DAC) |
| MVD21202 | VLSI Technology | Core | 3 | Semiconductor Material Properties, Oxidation, Lithography, and Etching, Diffusion and Ion Implantation, Thin Film Deposition Techniques, CMOS Process Flow and Integration, Wafer Fabrication and Packaging |
| MVD21203 | VLSI Design Lab II | Lab | 2 | Analog IC Design and Simulation, Mixed-Signal Simulation and Verification, FPGA-based System Integration, Advanced Digital Design Verification, Hardware-Software Co-design Principles, Project-based Learning on VLSI Subsystems |
| MVD212E2 | Advanced Computer Architecture | Elective | 3 | Pipelining and Parallelism, Instruction Level Parallelism (ILP), Memory Hierarchy and Cache Design, Multiprocessor Architectures, GPU Architecture and Parallel Programming, Network-on-Chip (NoC) Concepts |
| MVD212E3 | SoC Design | Elective | 3 | System-on-Chip Architectures, IP Core Integration and Reuse, Bus Architectures (AMBA, AXI), Hardware/Software Partitioning, SoC Verification Methodologies, Design for Testability in SoCs |
| RMC21002 | Soft Skills and Professional Ethics | Core | 1 | Effective Communication Skills, Presentation and Public Speaking, Teamwork and Leadership Qualities, Ethical Principles in Engineering, Professional Responsibility and Conduct, Stress Management and Time Management |
Semester 3
| Subject Code | Subject Name | Subject Type | Credits | Key Topics |
|---|---|---|---|---|
| MVD21301 | Hardware Description Languages | Core | 3 | VHDL/Verilog Syntax and Semantics, Behavioral, Dataflow, and Structural Modeling, Testbench Creation and Simulation, HDL Synthesis and Optimization, Advanced HDL Constructs, Design Examples and Case Studies |
| MVD21302 | Testing of VLSI Circuits | Core | 3 | Fault Models and Fault Simulation, Test Pattern Generation Algorithms, Design for Testability (DFT), Scan Chain Design and Implementation, Built-In Self-Test (BIST), Boundary Scan (JTAG) Standards |
| MVD213E4 | Low Power VLSI Design | Elective | 3 | Sources of Power Dissipation in CMOS, Low Power Design Techniques, Voltage and Frequency Scaling, Clock Gating and Power Gating, Device and Technology Optimization for Low Power, Low Power Architectures and Methodologies |
| MVD213E5 | RFIC Design | Elective | 3 | RF Device Modeling and Characteristics, Low Noise Amplifiers (LNAs), Mixers and Voltage Controlled Oscillators (VCOs), Power Amplifiers for RF Applications, RF Transceiver Architectures, Matching Networks and Impedance Matching |
| MVD213P1 | Project Work - Phase I | Project | 6 | Problem Identification and Literature Survey, Formulation of Design Specifications, Preliminary System Design and Architecture, Simulation and Feasibility Analysis, Interim Report Writing, Presentation of Proposed Work |
Semester 4
| Subject Code | Subject Name | Subject Type | Credits | Key Topics |
|---|---|---|---|---|
| MVD214P2 | Project Work - Phase II | Project | 18 | Detailed Design and Implementation, Verification and Validation of Design, Testing and Characterization, Performance Analysis and Optimization, Dissertation Writing and Documentation, Final Defense and Presentation |
